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EP2C8T144C8N Datasheet, PDF (463/470 Pages) Altera Corporation – Cyclone II Device Handbook, Volume 1 | |||
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Package Information for Cyclone II Devices
484-Pin Ultra FineLine BGA â Wirebond
â All dimensions and tolerances conform to ASME Y14.5M â 1994.
â Controlling dimension is in millimeters.
â Pin A1 may be indicated by an ID dot, or a special feature, in its
proximity on package surface.
Tables 15â15 and 15â16 show the package information and package
outline figure references, respectively, for the 484-pin Ultra FineLine
BGA package.
Table 15â15. 484-Pin Ultra FineLine BGA Package Information
Description
Ordering Code Reference
Package Acronym
Substrate Material
Solder Ball Composition
JEDEC Outline Reference
Maximum Lead Coplanarity
Weight
Moisture Sensitivity Level
Specification
U
UBGA
BT
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
MO-216 Variation: BAP-2
0.005 inches (0.12mm)
1.8 g
Printed on moisture barrier bag
Table 15â16. 484-Pin Ultra FineLine BGA Package Outline Dimensions
Symbol
A
A1
A2
A3
D
E
b
e
Min.
â
0.20
0.65
0.40
Millimeter
Nom.
â
â
â
0.80 TYP
19.00 BSC
19.00 BSC
0.50
0.80 BSC
Max.
2.20
â
â
0.60
Altera Corporation
February 2007
15â15
Cyclone II Device Handbook, Volume 1
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