|
EP2C8T144C8N Datasheet, PDF (10/470 Pages) Altera Corporation – Cyclone II Device Handbook, Volume 1 | |||
|
◁ |
Contents
Guidelines for IEEE Std. 1149.1 Boundary-Scan Testing ............................................................. 14â18
Boundary-Scan Description Language (BSDL) Support .............................................................. 14â19
Conclusion .......................................................................................................................................... 14â19
References ........................................................................................................................................... 14â19
Document Revision History ............................................................................................................. 14â20
Section VII. PCB Layout Guidelines
Revision History .................................................................................................................................. 14â1
Chapter 15. Package Information for Cyclone II Devices
Introduction .......................................................................................................................................... 15â1
Thermal Resistance .............................................................................................................................. 15â2
Package Outlines ................................................................................................................................. 15â4
144-Pin Plastic Thin Quad Flat Pack (TQFP) â Wirebond ........................................................ 15â4
208-Pin Plastic Quad Flat Pack (PQFP) â Wirebond ................................................................. 15â7
240-Pin Plastic Quad Flat Pack (PQFP) ....................................................................................... 15â9
256-Pin FineLine Ball-Grid Array, Option 2 â Wirebond ....................................................... 15â11
484-Pin FineLine BGA, Option 3 â Wirebond .......................................................................... 15â13
484-Pin Ultra FineLine BGA â Wirebond ................................................................................. 15â15
672-Pin FineLine BGA Package, Option 3 â Wirebond ........................................................... 15â17
896-Pin FineLine BGA Package â Wirebond ............................................................................ 15â19
x
Cyclone II Device Handbook, Volume 1
Altera Corporation
|
▷ |