XC3SD3400A-4FGG676C Datasheet, PDF (65/101 Pages) Xilinx, Inc – Spartan-3A DSP FPGA Family Data Sheet

Spartan-3A DSP FPGA Family: Pinout Descriptions
Package Thermal Characteristics
The power dissipated by an FPGA application has implications on package selection and system design. The power
consumed by a Spartan-3A DSP FPGA is reported using either the XPower Power Estimator or the XPower Analyzer
calculator integrated in the Xilinx ISE® development software. Table 62 provides the thermal characteristics for the various
Spartan-3A DSP device package offerings. This information is also available using the Thermal Query tool.
The junction-to-case thermal resistance (θ_JC) indicates the difference between the temperature measured on the package
body (case) and the die junction temperature per watt of power consumption. The junction-to-board (θ_JB) value similarly
reports the difference between the board and junction temperature. The junction-to-ambient (θ_JA) value reports the
temperature difference between the ambient environment and the junction temperature. The θ_JA value is reported at
different air velocities, measured in linear feet per minute (LFM). The “Still Air (0 LFM)” column shows the θ_JA value in a
system without a fan. The thermal resistance drops with increasing air flow.
Table 62: Spartan-3A DSP FPGA Package Thermal Characteristics
Package
Device
Junction-to-Case
(θ_JC)
Junction-to-
Board (θ_JB)
Junction-to-Ambient (θ_JA)
at Different Air Flows
Still Air
(0 LFM)
250 LFM
500 LFM 750 LFM
CS484 XC3SD1800A
4.1
CSG484 _XC3SD3400A
3.5
6.8
18.0
13.3
12.3
11.5
5.6
16.9
12.2
11.0
10.4
FG676 XC3SD1800A
4.7
FGG676 _XC3SD3400A
3.8
7.8
15.9
11.6
10.6
10.0
6.4
14.7
10.5
9.4
8.9
Units
°C/W
°C/W
°C/W
°C/W
DS610 (v3.0) October 4, 2010
www.xilinx.com
Product Specification
65