XC3SD3400A-4FGG676C Datasheet, PDF (64/101 Pages) Xilinx, Inc – Spartan-3A DSP FPGA Family Data Sheet

Spartan-3A DSP FPGA Family: Pinout Descriptions
Electronic versions of the package pinout tables and foot- prints are available for download from the Xilinx® website. Using
a spreadsheet program, the data can be sorted and reformatted according to any specific needs. Similarly, the ASCII-text file
is easily parsed by most scripting programs. www.xilinx.com/support/documentation/data_sheets/s3a_pin.zip
Package Overview
Table 60 shows the two low-cost, space-saving production package styles for the Spartan-3A DSP family.
Table 60: Spartan-3A DSP Family Package Options
Package
Leads
Type
CS484 / CSG484
FG676 / FGG676
484 Chip-Scale Ball Grid Array (CS)
676 Fine-pitch Ball Grid Array (FBGA)
Maximum
I/O
309
519
Lead Pitch
(mm)
0.8
1.0
Footprint
Area (mm)
19 x 19
27 x 27
Height
(mm)
1.80
2.60
Mass⁽¹⁾
(g)
1.4
3.4
Notes:
1. Package mass is ±10%.
Each package style is available as a standard and an environmentally friendly lead-free (Pb-free) option. The Pb-free
packages include an extra ‘G’ in the package style name. For example, the standard “CS484” package becomes “CSG484”
when ordered as the Pb-free option. The mechanical dimensions of the standard and Pb-free packages are similar, as
shown in the mechanical drawings provided in Table 61.
For additional package information, see UG112: Device Package User Guide.
Mechanical Drawings
Detailed mechanical drawings for each package type are available from the Xilinx web site at the specified location in
Table 61.
Material Declaration Data Sheets (MDDS) are also available on the Xilinx web site for each package.
Table 61: Xilinx Package Documentation
Package
Drawing
MDDS
CS484
Package Drawing PK230_CS484
CSG484
PK231_CSG484
FG676
Package Drawing PK155_FG676
FGG676
PK111_FGG676
DS610 (v3.0) October 4, 2010
www.xilinx.com
Product Specification
64