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K5L5628JTM Datasheet, PDF (94/98 Pages) Samsung semiconductor – 256M Bit (16M x16) Synchronous Burst , Multi Bank NOR Flash / 128M Bit(8M x16) Synchronous Burst UtRAM
K5L5628JT(B)M
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MCP MEMORY
TRANSITION TIMING WAVEFORM BETWEEN READ AND WRITE
Fig.36 ASYNCH. WRITE(Address Latch Type) to SYNCH. BURST READ TIMING WAVEFORM
[Latency=5, Burst Length=4](MRS=VIH)
CLK
ADV
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
T
tAS(A)
tADV
tAH(A)
tADVS
tADVH
tAS(B)
tAH(B)
Address
CS
WE
OE
Valid
Don’t Care
tCSS(A)
tAW
tCW
tWLRL
tWP
tAS
Valid
Don’t Care
tCSS(B)
tBC
tOEL
LB, UB
Data in
Data out
WAIT
tBW
tDW tDH
Data Valid
High-Z
Read Latency 5
High-Z
tBEL
Latency 5
tCD
tOH
tHZ
DQ0 DQ1 DQ2 DQ3
tWL
tWH
tWZ
(SYNCHRONOUS BURST READ CYCLE)
1. The new burst operation can be issued only after the previous burst operation is finished. For the new burst operation, tBEADV
should be met.
2. /WAIT Low(tWL or tAWL) : Data not available(driven by CS low going edge or ADV low going edge)
/WAIT High(tWH) : Data available(driven by Latency-1 clock)
/WAIT High-Z(tWZ) : Data don’t care(driven by CS high going edge)
3. Multiple clock risings are allowed during low ADV period. The burst operation starts from the first clock rising.
4. Burst Cycle Time(tBC) should not be over 2.5µs.
(ADDRESS LATCH TYPE ASYNCHRONOUS WRITE CYCLE - WE controlled)
1. Clock input does not have any affect to the write operation if WE is driven to low before Read Latency-1 clock. Read Latency-1 clock
in write timing is just a reference to WE low going for proper write operation.
Table 40. ASYNCH. WRITE(Address Latch Type) to BURST READ AC CHARACTERISTICS
Symbol
tWLRL
Speed
Min
Max
1
-
Units
clock
Symbol
Speed
Min
Max
Units
94
Revision 1.0
November 2004