PIC18F1220_07 Datasheet, PDF (290/308 Pages) Microchip Technology – 18/20/28-Pin High-Performance, Enhanced Flash Microcontrollers with 10-bit A/D and nanoWatt Technology

PIC18F1220/1320
20-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
12
e
b
c
A
A2
φ
A1
L1
L
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
20
Pitch
e
0.65 BSC
Overall Height
A
–
–
2.00
Molded Package Thickness
A2
1.65
1.75
1.85
Standoff
A1
0.05
–
–
Overall Width
E
7.40
7.80
8.20
Molded Package Width
E1
5.00
5.30
5.60
Overall Length
D
6.90
7.20
7.50
Foot Length
L
0.55
0.75
0.95
Footprint
L1
1.25 REF
Lead Thickness
c
0.09
–
0.25
Foot Angle
φ
0°
4°
8°
Notes:
Lead Width
b
0.22
–
0.38
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-072B
DS39605F-page 288
© 2007 Microchip Technology Inc.