MSC8144EC Datasheet, PDF (75/80 Pages) Freescale Semiconductor, Inc – Quad Core Digital Signal Processor

Ordering Information
4 Ordering Information
Consult a Freescale Semiconductor sales office or authorized distributor to determine product availability and place an order.
Part
Package Type
MSC8144E Flip Chip Plastic Ball Grid Array (FC-PBGA)
C
Spheres
Lead-free
Core
Voltage
Operating
Temperature
Core
Frequency
(MHz)
Order Number
1.0 V
–40° to 105°C
0° to 90°C
800
1000
TBD
TBD
5 Package Information
Notes:
1. All dimensions in millimeters.
2. Dimensioning and tolerancing
per ASME Y14.5M–1994.
3. Maximum solder ball diameter
measured parallel to Datum A.
4. Datum A, the seating plane, is
determined by the spherical
crowns of the solder balls.
5. Parallelism measurement
should exclude any effect of
marking.
6. Capacitors may not be present
on all devices.
7. Caution must be taken not to
short exposed metal capacitor
pads on package top.
CASE NO. 1842-02
Figure 45. MSC8144EC Mechanical Information, 783-ball FC-PBGA Package
MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 6
Freescale Semiconductor
75