MSC8144EC Datasheet, PDF (28/80 Pages) Freescale Semiconductor, Inc – Quad Core Digital Signal Processor

Electrical Characteristics
2.4 Thermal Characteristics
Table 5 describes thermal characteristics of the MSC8144EC for the FC-PBGA packages.
Table 5. Thermal Characteristics for the MSC8144EC
Characteristic
Symbol
FC-PBGA
29 × 29 mm⁵
Unit
Natural
200 ft/min
Convection
(1 m/s) airflow
Junction-to-ambient^{1, 2}
Junction-to-ambient, four-layer board^{1, 3}
Junction-to-board (bottom)⁴
Junction-to-case⁵
R_θJA
20
R_θJA
15
R_θJB
7
R_θJC
0.8
15
°C/W
12
°C/W
°C/W
°C/W
Notes: 1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on
the top surface of the board near the package.
5. Thermal resistance between the active surface of the die and the case top surface determined by the cold plate method (MIL
SPEC-883 Method 1012.1) with the calculated case temperature.
2.5 Power Characteristics
The estimated typical power dissipation for MSC8144EC versus the core frequency is shown in Table 6.
Table 6. Power Dissipation
Extended Core Frequency
Core Frequency
Typical
Unit
266
400
TBD
W
533
TBD
667
TBD
800
TBD
333
500
TBD
W
667
TBD
833
TBD
1000
TBD
400
400
TBD
W
600
TBD
800
TBD
1000
TBD
500
500
TBD
W
750
TBD
1000
TBD
Note: Measured for 1.0 V core at 25°C junction temperature.
The typical power values were measured using an EFR code with the device running at a junction temperature of 25°C. No
peripherals were enabled and the ICache was not enabled. The source code was optimized to use all the ALUs and AGUs and
MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 6
28
Freescale Semiconductor