MC68HC16Z1 Datasheet, PDF (360/500 Pages) Freescale Semiconductor, Inc – M68HC16Z Series

Freescale Semiconductor, Inc.
A1
S1
1
17
A
S
J
J1
N
117
VIEW AB ¹⁸
L
50
PIN 1
IDENT
AA
116
V1 B1
M
P
AA
P1
B
V
84
51
83
0.016 H L–M N _4X
0.010 T L–M N _{4X 33 TIPS}
0.012 H L–M N _4X
0.002 N _2X
0.002 L–M _2X
C C2
C1
0.004 T _132X
SEATING
PLANE
T
132X D1
0.008 M T L–M N
R R1
K1
H
U
132X D
0.008 M T L–M N
KW
q
SECTION AA–AA
GAGE
PLANE
AC AC
128X G
X
X=L, M, OR N
CL
VIEW AB
BASE
METAL
E_{ÍÍÍÇÇÍÍÍÇÇÍÍÍ}^(D) _{ÇÇÍÍÍ}
D2
E1
PLATING
SECTION AC–AC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1982.
2. DIMENSIONS IN INCHES.
3. DIMENSIONS A, B, J, AND P DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE MOLD
PROTRUSION FOR DIMENSIONS A AND B IS 0.007,
FOR DIMENSIONS J AND P IS 0.010.
4. DATUM PLANE H IS LOCATED AT THE UNDERSIDE
OF LEADS WHERE LEADS EXIT PACKAGE BODY.
5. DATUMS L, M, AND N TO BE DETERMINED WHERE
CENTER LEADS EXIT PACKAGE BODY AT DATUM H.
6. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE, DATUM T.
7. DIMENSIONS A, B, J, AND P TO BE DETERMINED AT
DATUM PLANE H.
8. DIMENSION F DOES NOT INCLUDE DAMBAR
PROTRUSIONS. DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.019.
INCHES
DIM MIN MAX
A 1.100 BSC
A1 0.550 BSC
B 1.100 BSC
B1 0.550 BSC
C 0.160 0.180
C1 0.020 0.040
C2 0.135 0.145
D 0.008 0.012
D1 0.012 0.016
D2 0.008 0.011
E 0.006 0.008
E1 0.005 0.007
F 0.014 0.014
G 0.025 BSC
J
0.950 BSC
J1 0.475 BSC
K 0.034 0.044
K1 0.010 BSC
P
0.950 BSC
P1 0.475 BSC
R1 0.013 REF
S
1.080 BSC
S1 0.540 BSC
U 0.025 REF
V
1.080 BSC
V1 0.540 BSC
W 0.006 0.008
q 0_{_} 8_{_}
Figure B-3 Case 831A-01 — 132-Pin Package Dimensions
MECHANICAL DATA AND ORDERING INFORMATION M68HC16 Z SERIES
B-4
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