MC9S12XD256CAG Datasheet, PDF (1243/1348 Pages) Freescale Semiconductor, Inc – MC9S12XDP512 Data Sheet

Appendix A Electrical Characteristics
Table A-5. Thermal Package Characteristics¹
Num C
Rating
Symbol
Min
Typ
Max
Unit
LQFP144
1 T Thermal resistance LQFP144, single sided PCB²
θ_JA
—
—
41
°C/W
2 T Thermal resistance LQFP144, double sided PCB
with 2 internal planes³
θ_JA
—
—
32
°C/W
3
Junction to Board LQFP 144
4
Junction to Case LQFP 144⁴
5
Junction to Package Top LQFP144⁵
θ_JB
—
—
22
°C/W
θ_JC
—
—
7/4
°C/W
Ψ_JT
—
—
3
°C/W
LQFP112
6 T Thermal resistance LQFP112, single sided PCB²
7 T Thermal resistance LQFP112, double sided PCB
with 2 internal planes⁵
θ_JA
—
—
43³/49⁴ °C/W
θ_JA
—
—
32³/39⁴ °C/W
8
Junction to Board LQFP112
9
Junction to Case LQFP112⁴
10
Junction to Package Top LQFP112⁵
θ_JB
—
—
22³/27⁴ °C/W
θ_JC
—
—
7³/11⁴ °C/W
Ψ_JT
—
—
3/2
°C/W
QFP80
11 T Thermal resistance QFP 80, single sided PCB²
12 T Thermal resistance QFP 80, double sided PCB
with 2 internal planes³
θ_JA
—
—
45³/49⁴ °C/W
θ_JA
—
—
33³/36⁴ °C/W
13 T Junction to Board QFP 80
θ_JB
—
—
19³/20⁴ °C/W
14 T Junction to Case QFP 80⁶
θ_JC
—
—
11³/14⁴ °C/W
15 T Junction to Package Top QFP 80⁷
Ψ_JT
—
—
3
°C/W
1 _{The values for thermal resistance are achieved by package simulations}
2 _{Junction to ambient thermal resistance, θJA was simulated to be equivalent to the JEDEC specification JESD51-2 in a}
horizontal configuration in natural convection.
3 _{Maskset L15Y / M84E in LQFP112 or QFP80}
4 _{Maskset M42E in LQFP112 or QFP80}
5 _{Junction to ambient thermal resistance, θJA was simulated to be equivalent to the JEDEC specification JESD51-7 in a}
horizontal configuration in natural convection.
6 _{Junction to case thermal resistance was simulated to be equivalent to the measured values using the cold plate technique with}
the cold plate temperature used as the “case” temperature. This basic cold plate measurement technique is described by
MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the package
is being used with a heat sink.
7 _{Thermal characterization parameter ΨJT is the “resistance” from junction to reference point thermocouple on top center of the}
case as defined in JESD51-2. Ψ_JT is a useful value to use to estimate junction temperature in a steady state customer
enviroment.
Freescale Semiconductor
MC9S12XDP512 Data Sheet, Rev. 2.21
1245