AK4671_10 Datasheet, PDF (163/166 Pages) Asahi Kasei Microsystems – Stereo CODEC with MIC/RCV/HP-AMP

5.0 ± 0.1
[AK4671]
PACKAGE
57 - φ 0.3 ± 0.05
φ 0.05 M S AB
0.5
9 8 7 65 4 3 2 1
A
B
B
C
D
E
F
G
H
J
0.5
S
0.08 S
■ Material & Lead finish
Package molding compound:
Interposer material:
Solder ball material:
Epoxy, Halogen (bromine and chlorine) free
BT resin
SnAgCu
MS0666-E-02
- 163 -
2010/06