DS125DF1610 Datasheet, PDF (8/81 Pages) Texas Instruments – 9.8 to 12.5 Gbps 16-Channel Retimer

DS125DF1610
SNLS482A – APRIL 2014 – REVISED DECEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings⁽¹⁾
Over operating free-air temperature range (unless otherwise noted)
Supply Voltage (VDD)
LVCMOS Input/Output Voltage
Open Drain I/O Supply Voltage
CML Input Voltage
CML Input Current
Storage temperature range, T_stg
MIN
MAX
UNIT
–0.5
2.75
V
–0.5
2.75
V
–0.5
4.0
V
–0.5
(VDD + 0.5)
V
–30
30
mA
-40
150
°C
(1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications
6.2 Handling Ratings
V_(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins⁽²⁾
VALUE
±4,000
±1,000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
Supply Voltage
Ambient Temperature
SMBus (SDA, SCL), INTERR_IO
Maximum Continuous Junction Temperature while Device is Operational
MIN
2.375
-20
TYP
MAX UNIT
2.5
2.625
V
25
85
°C
2.5
3.6
V
115
°C
6.4 Thermal Information
THERMAL METRIC^{(1) (2)}
DS125DF1610
FCBGA ABB
(196) PINS
UNIT
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
18.2
0.7
5.3
°C/W
0.8
5.3
N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) Thermal model available upon request
6.5 Additional Thermal Information
BOARD
JEDEC 4 layer board, no airflow
θ_JC (°C / W)
0.7
8x6 inches 10 layer, no airflow
0.7
8x6 inches 20 layer, no airflow
0.7
8x6 inches 30 layer, no airflow
0.7
θ_JA (°C / W)
18.2
7.2
6.4
6.3
ψ_JT(°C / W)
0.8
0.3
0.3
0.3
ψ_JB(°C / W)
5.3
3.2
3.2
3.2
8
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