TLK10081 Datasheet, PDF (58/62 Pages) Texas Instruments – 10Gbps 1-8 CHANNEL MULTI-RATE SERIAL LINK AGGREGATOR

TLK10081
SLLSEE9 – NOVEMBER 2013
8 MECHANICAL AND THERMAL DATA
8.1 Package Thermal Dissipation Ratings
Table 8-1 details the thermal characteristics of the TLK10081 package.
Table 8-1. Package Thermal Characteristics
JEDEC STANDARD BOARD
PARAMETER
VALUE
Θ_JA
Theta-JA
Ψ_JT
Psi-JT
Ψ_JB
Psi-JB
25.5
1.8
13.7
CUSTOM TYPICAL APPLICATION BOARD⁽¹⁾
Θ_JA
Theta-JA
Ψ_JT
Psi-JT
Ψ_JB
Psi-JB
24.5
0.9
11
(1) Custom Typical Application Board Characteristics:
• 10x15 inches
• 12 layer
• 8 power/ground layers – 95% copper (1oz)
• 4 signal layers – 20% copper (1oz)
SPACER
Ψ_JB = (T_J – T_B)/(Total Device Power Dissipation)
ΨJB = (TJ T_J = Device Junction Temperature
ΨJB = (TJ T_B = Temperature of PCB 1 mm from device edge.
SPACER
Ψ_JT = (T_J – T_C)/(Total Device Power Dissipation)
ΨJB = (TJ T_J = Device Junction Temperature
ΨJB = (TJ T_C = Hottest temperature on the case of the package.
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58
MECHANICAL AND THERMAL DATA
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