K522H1HACF-B050 Datasheet, PDF (9/94 Pages) Samsung semiconductor – MCP Specification

K522H1HACF-B050
datasheet
7. PACKAGE DIMENSION
Rev. 1.0
MCP Memory
153-Ball Fine pitch Ball Grid Array Package (measured in millimeters)
Units:millimeters
8.00±0.10
#A1
TOP VIEW
(Datum A) _A
B
C
D
(Datum B)
E
F
G
H
J
K
L
M
N
P
8.00±0.10
0.50 x 13 = 6.50
14 13 12 11 10 9 8 7 6 5 4 3 2 1
0.22±0.05
3.25
0.50
0.25
0.90±0.10
153-∅0.30±0.05
∅ 0.20 M A B
BOTTOM VIEW
A
#A1 INDEX MARK
B
-9-