K522H1HACF-B050 Datasheet, PDF (34/94 Pages) Samsung semiconductor – MCP Specification

K522H1HACF-B050
3rd ID Data
ITEM
Internal Chip Number
Cell Type
Number of Simultaneously
Programmed Pages
Interleave Program
Between Multii-Chips
Cache Program
4th ID Data
ITEM
Page Size
(without Redundant Area)
Block Size
(without Redundant Area)
Redundant Area Size
(Byte/512byte)
Organization
Reserved
datasheet
Rev. 1.0
MCP Memory
Description
1
2
4
8
2 Level Cell
4 Level Cell
8 Level Cell
16 Level Cell
1
2
4
8
Not supported
supported
Not supported
supported
I/O #
7
6
5
4
3
2
1
0
0
0
0
1
1
0
1
1
0
0
0
1
1
0
1
1
0
0
0
1
1
0
1
1
0
1
0
1
Description
1KB
2KB
4KB
8KB
64KB
128KB
256KB
512KB
8
16
Reserved
Reserved
X8
X16
I/O #
7
6
5
4
3
2
1
0
0
0
0
1
1
0
1
1
0
0
0
1
1
0
1
1
0
0
0
1
1
0
1
1
0
1
0 or 1
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