DS077 Datasheet, PDF (55/108 Pages) Xilinx, Inc – Product Availability

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Spartan-IIE FPGA Family: Pinout Tables
Spartan-IIE Package Pinouts
The Spartan^®-IIE family of FPGAs is available in five popu-
lar, low-cost packages, including plastic quad flat packs and
fine-pitch ball grid arrays. Family members have footprint
compatibility across devices provided in the same package,
with minor exceptions due to the smaller number of I/O in
smaller devices or due to LVDS/LVPECL pin pairing. The
Spartan-IIE family is not footprint compatible with any other
FPGA family. The following package-specific pinout tables
indicate function, pin, and bank information for all devices
available in that package. The pinouts follow the pad loca-
tions around the die, starting from pin 1 on the QFP pack-
ages.
Table 12: Spartan-IIE Family Package Options
Package
Leads
Type
Maximum
I/O
TQ144 / TQG144 144 Thin Quad Flat Pack (TQFP)
102
PQ208 / PQG208 208 Plastic Quad Flat Pack (PQFP)
146
FT256 / FTG256 256 Fine-pitch Thin Ball Grid Array (FBGA) 182
FG456 / FGG456 456 Fine-pitch Ball Grid Array (FBGA)
329
FG676 / FGG676 676 Fine-pitch Ball Grid Array (FBGA)
514
Lead Pitch
(mm)
0.5
0.5
1.0
1.0
1.0
Footprint
Area (mm)
22 x 22
30.6 x 30.6
17 x 17
23 x 23
27 x 27
Notes:
1. Package mass is ±10%.
Height
(mm)
1.60
3.70
1.55
2.60
2.60
Mass⁽¹⁾
(g)
1.4
5.3
1.0
2.2
3.1
Package Overview
Table 12 shows the five low-cost, space-saving production
package styles for the Spartan-IIE family.
Each package style is available in an environmentally
friendly lead-free (Pb-free) option. The Pb-free packages
include an extra ‘G’ in the package style name. For
example, the standard “TQ144” package becomes
“TQG144” when ordered as the Pb-free option. Leaded
(non-Pb-free) packages may be available for selected
devices, with the same pin-out and without the "G" in the
ordering code; contact Xilinx^® sales for more information.
The mechanical dimensions of the standard and Pb-free
packages are similar, as shown in the mechanical drawings
provided in Table 13.
For additional package information, see UG112: Device
Package User Guide.
Mechanical Drawings
Detailed mechanical drawings for each package type are
available from the Xilinx web site at the specified location in
Table 13.
Material Declaration Data Sheets (MDDS) are also
available on the Xilinx web site for each package.
Table 13: Xilinx Package Documentation
Package
Drawing
MDDS
TQ144
Package Drawing PK169_TQ144
TQG144
PK126_TQG144
PQ208
Package Drawing PK166_PQ208
PQG208
PK123_PQG208
FT256
Package Drawing PK158_FT256
FTG256
PK115_FTG256
FG456
Package Drawing PK154_FG456
FGG456
PK109_FGG456
FG676
Package Drawing PK155_FG676
FGG676
PK111_FGG676
DS077-4 (2.3) June 18, 2008
www.xilinx.com
55
Product Specification