DS077 Datasheet, PDF (12/108 Pages) Xilinx, Inc – Product Availability

Spartan-IIE FPGA Family: Functional Description
R
is required for most output standards and for LVTTL,
LVCMOS, and PCI inputs.
Table 4: Compatible Standards
V_CCO
3.3V
Compatible Standards
PCI, LVTTL, SSTL3 I, SSTL3 II, CTT, AGP,
LVPECL, GTL, GTL+
2.5V SSTL2 I, SSTL2 II, LVCMOS2, LVDS, Bus
LVDS, GTL, GTL+
1.8V LVCMOS18, GTL, GTL+
1.5V HSTL I, HSTL III, HSTL IV, GTL, GTL+
Some input standards require a user-supplied threshold
voltage, V_REF. In this case, certain user-I/O pins are auto-
matically configured as inputs for the V_REF voltage. About
one in six of the I/O pins in the bank assume this role.
V_REF pins within a bank are interconnected internally and
consequently only one V_REF voltage can be used within
each bank. All V_REF pins in the bank, however, must be con-
nected to the external voltage source for correct operation.
In a bank, inputs requiring V_REF can be mixed with those
that do not but only one V_REF voltage may be used within a
bank. The V_CCO and V_REF pins for each bank appear in the
device pinout tables.
Within a given package, the number of V_REF and V_CCO pins
can vary depending on the size of device. In larger devices,
more I/O pins convert to V_REF pins. Since these are always
a superset of the V_REF pins used for smaller devices, it is
possible to design a PCB that permits migration to a larger
device. All V_REF pins for the largest device anticipated must
be connected to the V_REF voltage, and not used for I/O.
Table 5: I/O Banking
Package
TQ144, PQ208
FT256, FG456,
FG676
V_CCO Banks
V_REF Banks
Interconnected as 1
8 independent
8 independent
8 independent
See Xilinx^® Application Note XAPP179 for more information
on I/O resources.
Hot Swap, Hot Insertion, Hot Socketing Support
The I/O pins support hot swap — also called hot insertion
and hot socketing — and are considered CompactPCI
Friendly according to the PCI Bus v2.2 Specification. Con-
sequently, an unpowered Spartan-IIE FPGA can be
plugged directly into a powered system or backplane with-
out affecting or damaging the system or the FPGA. The hot
swap functionality is built into every XC2S150E,
XC2S400E, and XC2S600E device. All other Spartan-IIE
devices built after Product Change Notice PCN2002-05 also
include hot swap functionality.
To support hot swap, Spartan-IIE devices include the follow-
ing I/O features.
• Signals can be applied to Spartan-IIE FPGA I/O pins
before powering the FPGA’s V_CCINT or V_CCO supply
inputs.
• Spartan-IIE FPGA I/O pins are high-impedance (i.e.,
three-stated) before and throughout the power-up and
configuration processes when employing a
configuration mode that does not enable the
preconfiguration weak pull-up resistors (see Table 11,
page 22).
• There is no current path from the I/O pin back to the
V_CCINT or V_CCO voltage supplies.
• Spartan-IIE FPGAs are immune to latch-up during hot
swap.
Once connected to the system, each pin adds a small
amount of capacitance (C_IN). Likewise, each I/O consumes
a small amount of DC current, equivalent to the input leak-
age specification (I_L). There also may be a small amount of
temporary AC current (I_HSPO) when the pin input voltage
exceeds V_CCO plus 0.4V, which lasts less than 10 ns.
A weak-keeper circuit within each user-I/O pin is enabled
during the last frame of configuration data and has no
noticeable effect on robust system signals driven by an
active driver or a strong pull-up or pull-down resistor.
Undriven or floating system signals may be affected. The
specific effect depends on how the I/O pin is configured.
User-I/O pins configured as outputs or enabled outputs
have a weak pull-up resistor to V_CCO during the last config-
uration frame. User-I/O pins configured as inputs or bidirec-
tional I/Os have weak pull-down resistors. The weak-keeper
circuit turns off when the DONE pin goes High, provided
that it is not used in the configured application.
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DS077-2 (v2.3) June 18, 2008
Product Specification