DS90UB914A-Q1 Datasheet, PDF (53/61 Pages) Texas Instruments – 25-MHz to 100-MHz 10/12-Bit FPD-Link III Deserializer

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DS90UB914A-Q1
SNLS499A – APRIL 2016 – REVISED JUNE 2016
11.2 Layout Example
Stencil parameters such as aperture area ratio and the fabrication process have a significant impact on paste
deposition. Inspection of the stencil prior to placement of the WQFN package is highly recommended to improve
board assembly yields. If the via and aperture openings are not carefully monitored, the solder may flow
unevenly through the DAP. Stencil parameters for aperture opening and via locations are shown below:
Figure 40. No Pullback WQFN, Single Row Reference Diagram
Table 11. No Pullback WQFN Stencil Aperture Summary for DS90UB914A-Q1
DEVICE
DS90UB914A-Q1
PIN
COUNT
MKT DWG
PCB I/O PAD
SIZE (mm)
PCB
PITCH
(mm)
48
RHS
0.25 x 0.6
0.5
PCB DAP
SIZE(mm)
5.1 x 5.1
STENCIL I/O
APERTURE
(mm)
0.25 x 0.7
STENCIL
DAP
APERTURE
(mm)
1.1 x 1.1
NUMBER OF
DAP
APERTURE
OPENINGS
16
GAP
BETWEEN
DAP
APERTURE
(Dim A mm)
0.2
Figure 41. 48-Pin WQFN Stencil Example of Via and Opening Placement
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