LMH1983 Datasheet, PDF (52/55 Pages) National Semiconductor (TI) – Generating 44.1 kHz Based highly integrated programmable audio

RTA0040A
A
SCALE 2.200
6.1
5.9
PACKAGE OUTLINE
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
B
PIN 1 INDEX AREA
6.1
0.5
5.9
0.3
0.3
0.2
0.8 MAX
0.05
0.00
DETAIL
OPTIONAL TERMINAL
TYPICAL
C
0.08
SEATING PLANE
36X 0.5
11
10
4.6 0.1
20
21
EXPOSED
THERMAL PAD
(0.1) TYP
4X
4.5
SEE TERMINAL
DETAIL
1
PIN 1 ID
40
(OPTIONAL)
30
31
40X
0.5
0.3
40X
0.3
0.2
0.1 C A B
0.05
NOTES:
4214989/A 12/2014
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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