LMH1983 Datasheet, PDF (48/55 Pages) National Semiconductor (TI) – Generating 44.1 kHz Based highly integrated programmable audio

PACKAGE OPTION ADDENDUM
www.ti.com
2-Dec-2014
PACKAGING INFORMATION
Orderable Device
LMH1983SQ/NOPB
LMH1983SQE/NOPB
LMH1983SQX/NOPB
Status Package Type Package Pins Package Eco Plan
(1)
Drawing
Qty
(2)
ACTIVE
WQFN
RTA
40 1000 Green (RoHS
& no Sb/Br)
ACTIVE
WQFN
RTA 40 250 Green (RoHS
& no Sb/Br)
ACTIVE
WQFN
RTA
40 2500 Green (RoHS
& no Sb/Br)
Lead/Ball Finish
(6)
CU SN
CU SN
CU SN
MSL Peak Temp Op Temp (°C)
(3)
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR -40 to 85
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
LMH1983
LMH1983
LMH1983
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
(4) _{There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.}
(5) _{Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation}
of the previous line and the two combined represent the entire Device Marking for that device.
(6) _{Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish}
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
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