LMH1983 Datasheet, PDF (2/55 Pages) National Semiconductor (TI) – Generating 44.1 kHz Based highly integrated programmable audio

LMH1983
SNLS309I – APRIL 2010 – REVISED DECEMBER 2014
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Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Description (continued)......................................... 3
6 Pin Configurations and Functions ....................... 3
7 Specifications......................................................... 5
7.1 Absolute Maximum Ratings ...................................... 5
7.2 ESD Ratings.............................................................. 5
7.3 Recommended Operating Conditions....................... 5
7.4 Thermal Information .................................................. 5
7.5 Electrical Characteristics........................................... 6
7.6 Frame Timing Outputs Timing Requirements ........... 8
7.7 Frame Timing Outputs Switching Characteristics ..... 8
7.8 Typical Characteristics .............................................. 9
8 Detailed Description ............................................ 11
8.1 Overview ................................................................. 11
8.2 Functional Block Diagram ....................................... 12
8.3 Feature Description................................................. 12
8.4 Device Functional Modes........................................ 20
8.5 Programming........................................................... 24
8.6 Register Map........................................................... 26
9 Applications and Implementation ...................... 35
9.1 Application Information............................................ 35
9.2 Typical Applications ................................................ 35
10 Power Supply Recommendations ..................... 43
11 Layout................................................................... 43
11.1 Layout Guidelines ................................................. 43
11.2 Layout Example .................................................... 44
12 Device and Documentation Support ................. 47
12.1 Documentation Support ........................................ 47
12.2 Trademarks ........................................................... 47
12.3 Electrostatic Discharge Caution ............................ 47
12.4 Glossary ................................................................ 47
13 Mechanical, Packaging, and Orderable
Information ........................................................... 47
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision H (October 2014) to Revision I
Page
• Updated ESD Ratings table.................................................................................................................................................... 5
• Updated formatting for Typical Characteristics graphs ......................................................................................................... 9
Changes from Revision G (Nov 2012) to Revision H
Page
• Added Added, updated, or renamed the following sections: Device Information Table, Pin Configuration and
Functions, Application and Implementation; Power Supply Recommendations; Layout; Device and Documentation
Support; Mechanical, Packaging, and Ordering Information ................................................................................................. 1
• Changed typical value of low output sink current to match simulation value of 1.25 mA. .................................................... 6
• Added clarification about PLL4 behavior. ............................................................................................................................ 15
• Added clarification section for LOR Determination .............................................................................................................. 17
• Changed appearance of Reg 0x11 mode description for clarity. ......................................................................................... 18
• Changed register initialization procedure to prevent device from exhibiting poor duty cycle performance on CLKout3 .... 19
• Added clarification note about 480i/29.97, 480p/59.94, 576i/25 and 576p/50 resolutions................................................... 23
• Changed default value for Reg 0x11[3:2] bits. .................................................................................................................... 28
• Changed Reg 0x11[3:2] description for clarification of TOF1_Sync behavior dependent on LOA window ......................... 28
2
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