LMH1983 Datasheet, PDF (5/55 Pages) National Semiconductor (TI) – Generating 44.1 kHz Based highly integrated programmable audio

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7 Specifications
LMH1983
SNLS309I – APRIL 2010 – REVISED DECEMBER 2014
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ^(1)(2)(3)
V_DD
V_I
V_O
T_JMAX
T_stg
Supply voltage
Input voltage (any input)
Output voltage (any output)
Junction temperature
Storage temperature range
MIN
MAX
UNIT
3.6
V
-0.3
V_DD + 0.3
V
-0.3
V_DD + 0.3
V
150
°C
-65
150
°C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) For soldering information, see SNOA549.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
7.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Machine model (MM)⁽²⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽³⁾
VALUE
2500
250
750
UNIT
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2500 V may actually have higher performance.
(2) Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC).
(3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±750 V may actually have higher performance.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Input Voltage
Temperature Range, T_A
MIN
NOM
0
-40
MAX
V_DD
85
UNIT
V
°C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
RTA
40 PINS
UNIT
T_JMAX
R_θJA
Junction Temperature, V_DD
Thermal Resistance⁽²⁾
3.3 ± 5%
33
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The maximum power dissipation is a function of T_J(MAX), R_θJA. The maximum allowable power dissipation at any ambient temperature is
PD = (T_J(MAX) – T_A)/ R_θJA. All numbers apply for packages soldered directly onto a PC Board.
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