LAN91C111_11 Datasheet, PDF (132/133 Pages) SMSC Corporation – 10/100 Non-PCI Ethernet Single Chip MAC + PHY

10/100 Non-PCI Ethernet Single Chip MAC + PHY
Datasheet
Figure 15.2 128 Pin QFP Package Outline, 3.9 MM Footprint
Table 15.2 128 Pin QFP Package Parameters
MIN
NOMINAL
MAX
REMARKS
A
~
A1
0.05
A2
2.55
D
23.70
D/2
11.85
D1
19.90
E
17.70
E/2
8.85
E1
13.90
H
~
L
0.73
L1
~
e
0.5 Basic
q
0^o
W
0.10
R1
0.13
R2
0.13
ccc
~
ccc
~
~
~
~
23.90
11.95
20.0
17.90
8.95
14.00
~
0.88
1.95
~
~
~
~
~
~
3.4
0.5
3.05
24.10
12.05
20.10
18.10
9.05
14.10
~
1.03
~
7^o
0.30
~
0.30
0.0762
0.08
Overall Package Height
Standoff
Body Thickness
X Span
1_{/2 X Span Measured from Centerline}
X body Size
Y Span
1_{/2 Y Span Measured from Centerline}
Y body Size
Lead Frame Thickness
Lead Foot Length
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Lead Shoulder Radius
Lead Foot Radius
Coplanarity (Assemblers)
Coplanarity (Test House)
Notes:
1. Controlling Unit: millimeter
2. Tolerance on the position of the leads is + 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Revision 1.92 (06-27-11)
132
DATASHEET
SMSC LAN91C111 REV C