LAN91C111_11 Datasheet, PDF (131/133 Pages) SMSC Corporation – 10/100 Non-PCI Ethernet Single Chip MAC + PHY

10/100 Non-PCI Ethernet Single Chip MAC + PHY
Datasheet
Chapter 15 Package Outlines
Figure 15.1 128 Pin TQFP Package Outline, 14X14X1.0 Body
Table 15.1 128 Pin TQFP Package Parameters
MIN
NOMINAL
MAX
A
~
~
A1
0.05
~
A2
0.95
1.00
D
15.80
16.00
D/2
7.90
8.00
D1
13.80
14.00
E
15.80
16.00
E/2
7.90
8.00
E1
13.80
14.00
H
0.09
~
L
0.45
0.60
L1
~
1.00
e
0.40 Basic
q
0^o
~
W
0.13
0.18
R1
0.08
~
R2
0.08
~
ccc
~
~
ccc
~
~
1.20
0.15
1.05
16.20
8.10
14.20
16.20
8.10
14.20
0.20
0.75
~
7^o
0.23
~
0.20
0.0762
0.08
REMARK
Overall Package Height
Standoff
Body Thickness
X Span
1_{/2 X Span Measure from Centerline}
X body Size
Y Span
1_{/2 Y Span Measure from Centerline}
Y body Size
Lead Frame Thickness
Lead Foot Length from Centerline
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Lead Shoulder Radius
Lead Foot Radius
Coplanarity (Assemblers)
Coplanarity (Test House)
Notes:
1. Controlling Unit: millimeter
2. Tolerance on the position of the leads is ± 0.035 mm maximum
3. Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane is 0.78-1.08 mm.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
6. Shoulder widths must conform to JEDEC MS-026 dimension 'S' of a minimum of 0.20mm.
SMSC LAN91C111 REV C
131
Revision 1.92 (06-27-11)
DATASHEET