K4B1G0446C Datasheet, PDF (7/63 Pages) Samsung semiconductor – 1Gb C-die DDR3 SDRAM Specification

K4B1G04(08/16)46C
1Gb DDR3 SDRAM
3.3 x16 Package Pinout (Top view) : 112ball FBGA Package(96balls + 16 balls of support balls)
1
2
3
4
567
8
9
10
11
A
NC
NC
NC
B
C
D
NC
VDDQ
DQU5
DQU7
E
VSSQ
VDD
VSS
F
VDDQ
DQU3
DQU1
G
VSSQ
VDDQ
DMU
H
VSS
VSSQ
DQL0
J
VDDQ
DQL2
DQSL
K
VSSQ
DQL6
DQSL
L
VREFDQ VDDQ
DQL4
M
NC
VSS
RAS
N
ODT
VDD
CAS
P
NC
CS
WE
R
VSS
BA0
BA2
T
VDD
A3
A0
U
VSS
A5
A2
V
VDD
A7
A9
W
NC
VSS
RESET
A13
Y
AA
AB
NC
NC
NC
NC
NC
NC
DQU4
VDDQ
VSS
NC
D
DQSU
DQU6
VSSQ
E
DQSU
DQU2
VDDQ
F
DQU0
VSSQ
VDD
G
DML
VSSQ
VDDQ
H
DQL1
DQL3
VSSQ
J
VDD
VSS
VSSQ
K
DQL7
DQL5
VDDQ
L
CK
VSS
NC
M
CK
VDD
CKE
N
A10/AP
ZQ
NC
P
A15 VREFCA VSS
R
A12/BC
BA1
VDD
T
A1
A4
VSS
U
A11
A6
VDD
V
NC
A8
VSS
NC
W
NC
NC
NC
Note1: A1,A2,A4,A8,A10,A11,D1,D11,W1,W11,AB1,AB2,AB4,AB8,AB10 and AB11 balls indicate mechanical support balls with no internal connection
Ball Locations (x16)
Populated ball
Ball not populated
Top view
(See the balls through the Package)
1 2 3 4 5 6 7 8 9 10 11
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
Page 7 of 63
Rev. 1.0 June 2007