K4B1G0446C Datasheet, PDF (6/63 Pages) Samsung semiconductor – 1Gb C-die DDR3 SDRAM Specification

K4B1G04(08/16)46C
1Gb DDR3 SDRAM
3.2 x8 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls)
1
2
3
4
567
8
9
10
11
A
NC
NC
NC
B
C
D
NC
VSS
VDD
NC
E
VSS
VSSQ
DQ0
F
VDDQ
DQ2
DQS
G
VSSQ
DQ6
DQS
H
VREFDQ VDDQ
DQ4
J
NC
VSS
RAS
K
ODT
VDD
CAS
L
NC
CS
WE
M
VSS
BA0
BA2
N
VDD
A3
A0
P
VSS
A5
A2
R
VDD
A7
A9
T
NC
VSS
RESET
A13
U
V
W
NC
NC
NC
NC
NC
NC
NU/TDQS VSS
VDD
NC
D
DM/TDQS VSSQ
VDDQ
E
DQ1
DQ3
VSSQ
F
VDD
VSS
VSSQ
G
DQ7
DQ5
VDDQ
H
CK
VSS
NC
J
CK
VDD
CKE
K
A10/AP
ZQ
NC
L
NC
VREFCA VSS
M
A12/BC
BA1
VDD
N
A1
A4
VSS
P
A11
A6
VDD
R
NC
A8
VSS
NC
T
NC
NC
NC
Note1: A1,A2,A4,A8,A10,A11,D1,D11,T1,T11,W1,W2,W4,W8,W10 and W11 balls indicate mechanical support balls with no internal connection
Ball Locations (x8)
Populated ball
Ball not populated
Top view
(See the balls through the Package)
1 2 3 4 5 6 7 8 9 10 11
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Page 6 of 63
Rev. 1.0 June 2007