MC68HC05B4 Datasheet, PDF (264/298 Pages) Motorola, Inc – High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcomputer Unit

14
Preliminary 100kΩ
1N914
0.01µF
RESET
RUN 1N914
1kΩ
TCAP1 VRH VDD
1.0µF
+
IRQ
OSC1
RESET OSC2
red LED
470Ω
NC
TCMP1
VPP1
RDI
VRL
TCAP2
100µF +
22pF
4.0 MHz
22pF
P1 1
2
3
GND
+5V
V_PP
47µF ₊
470Ω
PLMA
PD7
PLMB
PD6
Erase check & boot
Verify
EPROM
Boot
red LED — programming failed
green LED
PD5
PD3
Preliminary ^{green LED — programming OK}
Erase check
green LED — EPROM erased
red LED — EPROM not erased
+5V
1 27 28
VPP PGM VCC
A14
A13 ²⁶
20
CE
27C256
10
A0
A1
A2
A3
A4
A5
A6
A7
9
8
7
6
5
4
3
PD2
PD1
PD0
MC68HC705B32
MCU
PD4
SCLK
TDO
TCMP2
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
VPP6
PC7
EPROM erase
check
Program
EPROM
RAM
EPROM
1 kΩ
10k Ω
4k7Ω
4k7Ω
12 kΩ
BC239C
1nF ⁺
+5V
Note:
Preliminary ²⁵
24
21
23
2
A8
A9
A10
A11
A12
GND
14
D0
D1
D2
D3
D4
D5
D6
D7
11
12
13
15
16
17
18
19
OE
22
PA0
100 kΩ
PA1
PC5
PA2
PC6
PA3
PA4
PC4
PA5
PC3
PA6
PC2
PA7
PC1
VSS ^PC0
HDSK out
Short circuit if
handshake not used
A12 ^{HDSK in}
A11
A10
A9
A8
This circuit is recommended for programming only at 25°C and not for use in the
end application, or at temperatures other than 25°C. If used in the end application,
VPP6 should be tied to VDD to avoid damaging the device.
Figure H-7 EPROM parallel bootstrap schematic diagram
MOTOROLA
H-18
MC68HC705B32
TPG
MC68HC05B6
Rev. 4