MC68HC05B4 Datasheet, PDF (147/298 Pages) Motorola, Inc – High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcomputer Unit

12.2.2 64-pin quad flat pack (QFP)
L
48
49
33
32
-A-
L
Case No. 840C
64 lead QFP
-B-
B
V
B
B
P
- A, B, D -
Detail “A”
F
Detail “A”
64
17
1
16
-D-
A
0.20 M C A – B S D S
0.05 A – B
S
0.20 M H A – B S D S
Detail “C”
E
M
J
N
D
Section B–B
Base
Metal
0.20 M C A – B S D S
U
T
R
C
-C-
H
G
Seating
Plane
-H-
Datum
Plane
M
Q
K
W
X
Dim. Min. Max.
Notes
Dim. Min. Max.
A
13.90 14.10 _{1. Datum Plane –H– is located at bottom of lead and is coincident with} M
5 ° 10 °
B
13.90 14.10
the lead where the lead exits the plastic body at the bottom of the _N
0.130 0.170
C
2.067
2.457
parting line.
2. Datums A–B and –D to be determined at Datum Plane –H–.
P
0.40 BSC
D
0.30 0.45 _{3. Dimensions S and V to be determined at seating plane –C–.}
Q
2°
8°
E
2.00 2.40 ^{4. Dimensions A and B do not include mould protrusion. Allowable}
R
0.13 0.30
F
0.30 —
mould protrusion is 0.25mm per side. Dimensions A and B do
include mould mismatch and are determined at Datum Plane –H–.
S
16.20 16.60
G
0.80 BSC
5. Dimension D does not include dambar protrusion. Allowable
T
0.20 REF
H
0.067 0.250
dambar protrusion shall be 0.08 total in excess of the D dimension _U
9 ° 15 °
J
0.130 0.230
at maximum material condition. Dambar cannot be located on the
lower radius or the foot.
V
16.20 16.60
K
0.50 0.66 _{6. Dimensions and tolerancing per ANSI Y 14.5M, 1982.}
W
0.042 NOM
L
12.00 REF ^{7. All dimensions in mm.}
X 1.10 1.30
12
Figure 12-5 64-pin QFP mechanical dimensions
MC68HC05B6
Rev. 4
MECHANICAL DATA
TPG
MOTOROLA
12-5