MC68HC05B4 Datasheet, PDF (148/298 Pages) Motorola, Inc – High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcomputer Unit

12.2.3 56-pin shrink dual in line package (SDIP)
-A-
56
Case No. 859-01
56 lead SDIP
1
29
-B-
28
-T-
Seating
Plane
G
F
E
D
0.25 M T A S
C
K
N
L
H
M
J
0.25 M T B S
Dim. Min. Max.
Notes
Dim. Min. Max.
A 51.69 52.45
H
7.62 BSC
B
13.72 14.22 ^{1. Due to space limitations, this case shall be represented by a}
J
general case outline, rather than one showing all the leads.
C
3.94 5.08 _{2. Dimensions and tolerancing per ANSI Y 14.5 1982.}
K
0.20 0.38
2.92 3.43
D
0.36 0.56 3. All dimensions in mm.
L
15.24 BSC
E
0.89 BSC
4. Dimension L to centre of lead when formed parallel.
M
0°
15°
5. Dimensions A and B do not include mould flash. Allowable mould
F
0.81 1.17
flash is 0.25 mm.
N 0.51 1.02
G
1.778 BSC
Figure 12-6 56-pin SDIP mechanical dimensions
12
MOTOROLA
12-6
MECHANICAL DATA
TPG
MC68HC05B6
Rev. 4