MC68HC05B4 Datasheet, PDF (145/298 Pages) Motorola, Inc – High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcomputer Unit

12.1.3 56-pin shrink dual in line package (SDIP)
TCMP1 1
PD7 2
PD6 3
PD5 4
NC 5
NC/NU 6
NC 7
VRL 8
VRH 9
PD4 10
VDD 11
PD3 12
PD2 13
PD1 14
PD0 15
NC/VPP6 16
OSC1 17
OSC2 18
RESET 19
IRQ 20
PLMA 21
PLMB 22
TCAP1 23
TCAP2 24
PA7 25
PA6 26
PA5 27
PA4 28
56 TCMP2
55 TDO
54 SCLK
53 RDI
52 PC0
51 PC1
50 NC
49 PC2
48 PC3
47 PC4
46 PC5
45 PC6
44 PC7
43 VSS
42 VPP1/NC
41 PB0
40 PB1
39 PB2
38 PB3
37 PB4
36 PB5
35 NC
34 PB6
33 PB7
32 PA0
31 PA1
30 PA2
29 PA3
Device
MC68HC05B4
MC68HC05B6
MC68HC05B8
MC68HC05B16
MC68HC05B32
MC68HC705B5
MC68HC705B16
MC68HC705B16N
MC68HC705B32
Pin 6
Pin 16
Pin 42
NC
NC
NC
NC
NC
VPP1
NC
NC
VPP1
NC
NC
VPP1
NC
NC
VPP1
NC
VPP6
NC
Not available in this package
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NU
VPP6
VPP1
NC = Not connected
NU = Non-user pin (Should be tied to V_SS in an electrically noisy environment)
Figure 12-3 56-pin SDIP pinout for the MC68HC05B6
12
MC68HC05B6
Rev. 4
MECHANICAL DATA
TPG
MOTOROLA
12-3