MC68HC908JB8 Datasheet, PDF (265/286 Pages) Motorola, Inc – MICROCONTROLLERS

Mechanical Specifications
28-Pin Small Outline Integrated Circuit (SOIC)
19.4 28-Pin Small Outline Integrated Circuit (SOIC)
-A-
NOTES:
1. DIMENSIONING AND TOLERANCING PER
28
15
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
14X P
-B-
0.010 (0.25) M B M
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
1
14
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
28X D
AT MAXIMUM MATERIAL CONDITION.
0.010 (0.25) M T A S B S
M
R X 45
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 17.80 18.05 0.701 0.711
B 7.40 7.60 0.292 0.299
C
C 2.35 2.65 0.093 0.104
26X G
-T-
SEATING
PLANE
K
D 0.35 0.49 0.014 0.019
F 0.41 0.90 0.016 0.035
G
1.27 BSC
0.050 BSC
J 0.23 0.32 0.009 0.013
F
K 0.13 0.29 0.005 0.011
M 0°
8°
0°
8°
P 10.01 10.55 0.395 0.415
J
R 0.25 0.75 0.010 0.029
Figure 19-2. 28-Pin SOIC (Case 751F)
19.5 20-Pin Dual In-Line Package (PDIP)
–A–
20
1
–T–
SEATING
PLANE
E
G
F
11
B
10
C
K
N
D 20 PL
0.25 (0.010) M T A M
L
M
J 20 PL
0.25 (0.010) M
TBM
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 1.010 1.070 25.66 27.17
B 0.240 0.260 6.10 6.60
C 0.150 0.180 3.81 4.57
D 0.015 0.022 0.39 0.55
E 0.050 BSC
1.27 BSC
F 0.050 0.070 1.27 1.77
G 0.100 BSC
2.54 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.140 2.80 3.55
L 0.300 BSC
7.62 BSC
M
0_{_} 15_{_} 0_{_} 15_{_}
N 0.020 0.040 0.51 1.01
Figure 19-3. 20-Pin PDIP (Case 738)
MC68HC908JB8•MC68HC08JB8•MC68HC08JT8 — Rev. 2.3
Freescale Semiconductor
Mechanical Specifications
Technical Data
265