EP2C8T144I8N Datasheet, PDF (467/470 Pages) Altera Corporation – Cyclone II Device Handbook, Volume 1

Package Information for Cyclone II Devices
896-Pin FineLine BGA Package – Wirebond
■ All dimensions and tolerances conform to ASME Y14.5M - 1994.
■ Controlling dimension is in millimeters.
■ Pin A1’s location may be indicated by an ID dot in its proximity on
the package surface.
Tables 15–19 and 15–20 show the package information and package
outline figure references, respectively, for the 896-pin FineLine BGA.
Table 15–19. 896-Pin FineLine BGA Package Information
Description
Ordering code reference
Package acronym
Substrate material
Solder ball composition
JEDEC outline reference
Maximum lead coplanarity
Weight
Moisture sensitivity level
Specification
F
FineLine BGA
BT
Regular: 63Sn: 37Pb (typical)
Pb-free: Sn: 3.0Ag: 0.5Cu (typical)
MS-034 variation AAN-1
0.008 inches (0.20 mm)
11.5 g
Printed on moisture barrier bag
Table 15–20. 896-Pin FineLine BGA Package Outline Dimensions
Symbol
A
A1
A2
A3
D
E
b
e
Min.
–
0.30
–
–
0.50
Dimensions (mm)
Nom.
–
–
–
–
31.00 BSC
31.00 BSC
0.60
1.00 BSC
Max.
2.60
–
2.20
1.80
0.70
Altera Corporation
February 2007
15–19
Cyclone II Device Handbook, Volume 1