EP2C5T144I8N Datasheet, PDF (465/470 Pages) Altera Corporation – Cyclone II Device Handbook, Volume 1

Package Information for Cyclone II Devices
672-Pin FineLine BGA Package, Option 3 – Wirebond
■ All dimensions and tolerances conform to ASME Y14.5M - 1994.
■ Controlling dimension is in millimeters.
■ Pin A1 may be indicated by an ID dot, or a special feature, in its
proximity on the package surface.
Tables 15–17 and 15–18 show the package information and package
outline figure references, respectively, for the 672-pin FineLine BGA
package.
Table 15–17. 672-Pin FineLine BGA Package Information
Description
Ordering code reference
Package acronym
Substrate material
Solder ball composition
JEDEC Outline Reference
Maximum lead coplanarity
Weight
Moisture sensitivity level
Specification
F
FineLine BGA
BT
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
MS-034 Variation: AAL-1
0.008 inches (0.20 mm)
7.7 g
Printed on moisture barrier bag
Table 15–18. 672-Pin FineLine BGA Package Outline Dimensions
Symbol
A
A1
A2
A3
D
E
b
e
Min.
–
0.30
–
–
0.50
Dimensions (mm)
Nom.
–
–
–
–
27.00 BSC
27.00 BSC
0.60
1.00 BSC
Max.
2.60
–
2.20
1.80
0.70
Altera Corporation
February 2007
15–17
Cyclone II Device Handbook, Volume 1