EP2C5T144I8N Datasheet, PDF (451/470 Pages) Altera Corporation – Cyclone II Device Handbook, Volume 1

Package Information for Cyclone II Devices
Table 15–2. Thermal Resistance of Cyclone II Devices for Board Meeting JEDEC Specifications (Part 2 of 2)
Device
EP2C50
EP2C70
Pin
Count
Package
484 FineLine BGA
484 Ultra FineLine BGA
672 FineLine BGA
672 FineLine BGA
896 FineLine BGA
θ_{J A} (° C/W)
Still Air
18.4
19.6
17.7
16.9
16.3
θ_{J A} (° C/W) θ_{J A} (° C/W) θ_{J A} (° C/W)
100 ft./min. 200 ft./min. 400 ft./min.
14.4
12.4
10.9
15.6
13.6
11.9
13.7
11.8
10.2
13
11.1
9.7
11.9
10.5
9.1
θ_{J C}
(° C/W)
2.8
4.4
2.6
2.2
2.1
Table 15–3 provides board dimension information for each package.
Table 15–3. PCB Dimensions Notes (1), (2)
2.5 mm
Thick
F896
F672
F672
F484
F484
U484
U484
F256
Signal
Layers
10
8
7
7
6
7
6
6
Power/Ground
Layers
10
8
7
7
6
7
6
6
Package
Dimension
(mm)
31
27
27
23
23
19
19
17
Notes to Table 15–3:
(1) Power layer Cu thickness 35 um, Cu 90%
(2) Signal layer Cu thickness 17 um, Cu 15%
Board
Dimension
(mm)
91
87
87
83
83
79
79
77
Altera Corporation
February 2007
15–3
Cyclone II Device Handbook, Volume 1