EP2C5T144I8N Datasheet, PDF (463/470 Pages) Altera Corporation – Cyclone II Device Handbook, Volume 1

Package Information for Cyclone II Devices
484-Pin Ultra FineLine BGA – Wirebond
■ All dimensions and tolerances conform to ASME Y14.5M – 1994.
■ Controlling dimension is in millimeters.
■ Pin A1 may be indicated by an ID dot, or a special feature, in its
proximity on package surface.
Tables 15–15 and 15–16 show the package information and package
outline figure references, respectively, for the 484-pin Ultra FineLine
BGA package.
Table 15–15. 484-Pin Ultra FineLine BGA Package Information
Description
Ordering Code Reference
Package Acronym
Substrate Material
Solder Ball Composition
JEDEC Outline Reference
Maximum Lead Coplanarity
Weight
Moisture Sensitivity Level
Specification
U
UBGA
BT
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
MO-216 Variation: BAP-2
0.005 inches (0.12mm)
1.8 g
Printed on moisture barrier bag
Table 15–16. 484-Pin Ultra FineLine BGA Package Outline Dimensions
Symbol
A
A1
A2
A3
D
E
b
e
Min.
–
0.20
0.65
0.40
Millimeter
Nom.
–
–
–
0.80 TYP
19.00 BSC
19.00 BSC
0.50
0.80 BSC
Max.
2.20
–
–
0.60
Altera Corporation
February 2007
15–15
Cyclone II Device Handbook, Volume 1