TLK105 Datasheet, PDF (74/99 Pages) Texas Instruments – Industrial Temp, Single Port 10/100Mbs Ethernet Physical Layer Transceiver

TLK105
TLK106
SLLSEB8A – AUGUST 2012 – REVISED MARCH 2013
9 Electrical Specifications
All parameters are derived by test, statistical analysis, or design.
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9.1 ABSOLUTE MAXIMUM RATINGS⁽¹⁾
VDD33_IO, AVDD33
PFBIN1, PFBIN2
XI
TD-, TD+, RD-, RD+
Other Inputs
XO
Other outputs
T_J
ESD
Supply voltage
DC Input voltage
DC Output voltage
Maximum die temperature
Human-Body
Model
All pins⁽²⁾
Ethernet network pins (TD+, TD-, RD+, RD-)⁽³⁾
Charged-Device
Model
All pins⁽⁴⁾
VALUE
–0.3 to 3.8
–0.3 to 1.8
–0.3 to 3.8
–0.3 to 6
–0.3 to 3.8
–0.3 to 3.8
–0.3 to 3.8
125
±4
±16
±750
UNIT
V
V
V
°C
kV
V
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Tested in accordance to JEDEC Standard 22, Test Method A114.
(3) Test method based upon JEDEC Standard 22 Test Method A114, Ethernet network pins (TD+, TD-, RD+, RD-) pins stressed with
respect to GND.
(4) Tested in accordance to JEDEC Standard 22, Test Method C101.
9.2 RECOMMENDED OPERATING CONDITIONS
MIN
VDD33_IO, AVDD33 I/O and Analog 3.3V Supply
3.0
PFBIN1, PFBIN2 Core Supply voltage
1.47
T_A
Ambient
TLK105
–40
temperature ⁽¹⁾
TLK106
–40
P_D
Power dissipation⁽²⁾
(1) Provided that DOWN_PAD, pin 33, is soldered down. See Thermal Vias Recommendation for more detail.
(2) For 100Base-TX, When internal 1.55V is used. Device is operated from single 3.3V supply only.
NOM
3.3
1.55
270
9.3 THERMAL CHARACTERISTICS
9.3.1 TLK105 32-Pin Industrial Device (85°C) Thermal Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
CONDITIONS
MIN
TYP
θ_JA
θ_JB
θ_JC(Top)
θ_JC(Bottom)
Junction-to-ambient thermal resistance (no airflow)
Junction-to-board thermal resistance
Junction-to-case thermal resistance, Top
Junction-to-case thermal resistance, Bottom
JEDEC high-K model
36.4
9.3
26.8
1.7
MAX
3.6
1.62
85
105
UNIT
V
V
°C
mW
MAX UNIT
°C/W
9.3.2 TLK106 32-Pin Extended Temperature (105°C) Device Thermal Characteristics
74
Electrical Specifications
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