TLK105 Datasheet, PDF (37/99 Pages) Texas Instruments – Industrial Temp, Single Port 10/100Mbs Ethernet Physical Layer Transceiver

TLK105
TLK106
www.ti.com
SLLSEB8A – AUGUST 2012 – REVISED MARCH 2013
7.3 Thermal Vias Recommendation
The following thermal via guidelines apply to DOWN_PAD, pin 33:
1. Thermal via size = 0.2mm
2. Recommend 4 vias
3. Vias have a center to center separation of 2mm.
Adherence to this guideline is required to achieve the intended operating temperature range of the device.
Figure 7-3 illustrates an example layout.
Figure 7-3. Example Layout
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Design Guidelines
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