TLK100_11 Datasheet, PDF (69/88 Pages) Texas Instruments – Industrial Temp, Single Port 10/100 Mb/s Ethernet Physical Layer Transceiver

TLK100
www.ti.com
SLLS931B – AUGUST 2009 – REVISED DECEMBER 2009
9 Electrical Specifications
All parameters are derived by test, statistical analysis, or design.
9.1 ABSOLUTE MAXIMUM RATINGS⁽¹⁾
VDD33_IO, VDD33_VA11,
VDD33_V18, VDD33_VD11
V18_PFBIN1, V18_PFBIN2
VA11_PFBIN1, VA11_PFBIN2
XI
TD-, TD+, RD-, RD+
Other Inputs
XO
Other outputs
Maximum die temperature θ_J
ESD
Supply voltage
DC Input voltage
DC Output voltage
IEC 60749-26 ESD (human-body model)⁽²⁾
JEDEC Standard 22, Test Method A114 (human-body model)⁽²⁾
JEDEC Standard 22, Test Method A114 (human-body model), all pins
JEDEC Standard 22, Test Method C101 (charged-device model), all pins
VALUE
–0.3 to 3.8
–0.3 to 2.2
–0.3 to 1.8
–0.3 to 2.2
–0.3 to 6
–0.3 to 3.8
–0.3 to 2.2
–0.3 to 3.8
105
±16
±16
1.5
1.5
UNIT
V
V
V
V
V
V
V
V
°C
kV
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) On pins TD+, TD-, RD+, RD-, with VDD33_IO, VDD33_VA11 VDD33_V18, VDD33_VD11, V18_PFBIN1, V18_PFBIN2, VA11_PFBIN1,
VA11_PFBIN2, VA11_PFBOUT, V18_PFBOUT, VDD11, VSS connected to ground potential.
9.2 THERMAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
θ_JA
Junction-to-ambient thermal resistance (no airflow)
θ_JB
Junction-to-board thermal resistance
θ_JC
Junction-to-case thermal resistance
MIN
TYP
MAX UNIT
26.8
16.2
°C/W
40
9.3 RECOMMENDED OPERATING CONDITIONS
MIN
VDD33_VA11,VDD33_V18,
Core Supply voltage
2.38
VDD33_VD11
VDD33_IO
I/O 3.3V Supply
3.0
V18_PFBIN1, External Supply⁽¹⁾
1.7
V18_PFBIN2
VA11_PFBIN1,
VA11_PFBIN2
T_A
Ambient temperature⁽²⁾
P_D
Power dissipation⁽³⁾
1.04
–40
(1) When the internal voltage regulator is not used and the external supply is used
(2) Provided that GNDPAD, pin 49, is soldered down. See Thermal Vias Recommendation for more detail.
(3) For 100Base-TX, When external 1.8V, 1.1 and 3.3V supplies are used.
NOM
3.3
3.3
1.8
1.1
MAX UNIT
3.6 V
3.6 V
1.9 V
1.15 V
85 °C
189 mW
Copyright © 2009, Texas Instruments Incorporated
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