MC908AP32CFBE Datasheet, PDF (320/324 Pages) Freescale Semiconductor, Inc – The following revision history table summarizes changes contained in this document. For your convenience, the page number designators have been linked to the appropriate location.

Mechanical Specifications
23.4 42-Pin Shrink Dual In-Line Package (SDIP)
42
1
–T–
SEATING
PLANE
–A–
22
–B–
21
C
L
H
F
G
D 42 PL
0.25 (0.010) ^M T A ^S
N
K
M
J 42 PL
0.25 (0.010) ^M T B ^S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 1.435 1.465 36.45 37.21
B 0.540 0.560 13.72 14.22
C 0.155 0.200 3.94 5.08
D 0.014 0.022 0.36 0.56
F 0.032 0.046 0.81 1.17
G 0.070 BSC
1.778 BSC
H 0.300 BSC
7.62 BSC
J 0.008 0.015 0.20 0.38
K 0.115 0.135 2.92 3.43
L 0.600 BSC
15.24 BSC
M
0° 15°
0° 15°
N 0.020 0.040 0.51 1.02
Figure 23-3. 42-Pin SDIP (Case #858)
MC68HC908AP Family Data Sheet, Rev. 4
318
Freescale Semiconductor