MC9S08QG8 Datasheet, PDF (258/300 Pages) Freescale Semiconductor, Inc – 8-BIT HCS08 Central Processor Unit

Appendix A Electrical Characteristics
A.3 Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits, and it is user-determined rather than being controlled by the
MCU design. To take P_I/O into account in power calculations, determine the difference between actual pin
voltage and V_SS or V_DD and multiply by the pin current for each I/O pin. Except in cases of unusually high
pin current (heavy loads), the difference between pin voltage and V_SS or V_DD will be very small.
Table A-2. Thermal Characteristics
Rating
Operating temperature range
(packaged)
Thermal resistance
Single-layer board
8-pin PDIP
8-pin NB SOIC
8-pin DFN
16-pin PDIP
16-pin TSSOP
16-pin QFN
Thermal resistance
Four-layer board
8-pin PDIP
8-pin NB SOIC
8-pin DFN
16-pin PDIP
16-pin TSSOP
16-pin QFN
Symbol
T_A
Value
T_L to T_H
–40 to 85
Unit
°C
113
150
179
θ_JA
°C/W
78
133
132
72
87
41
θ_JA
°C/W
53
86
36
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 1.01
258
Freescale Semiconductor