MC9S08QG8 Datasheet, PDF (136/300 Pages) Freescale Semiconductor, Inc – 8-BIT HCS08 Central Processor Unit

Analog-to-Digital Converter (S08ADC10V1)
9.6.1.1 Analog Supply Pins
The ADC module has analog power and ground supplies (V_DDAD and V_SSAD) which are available as
separate pins on some devices. On other devices, V_SSAD is shared on the same pin as the MCU digital V_SS,
and on others, both V_SSAD and V_DDAD are shared with the MCU digital supply pins. In these cases, there
are separate pads for the analog supplies which are bonded to the same pin as the corresponding digital
supply so that some degree of isolation between the supplies is maintained.
When available on a separate pin, both V_DDAD and V_SSAD must be connected to the same voltage potential
as their corresponding MCU digital supply (V_DD and V_SS) and must be routed carefully for maximum
noise immunity and bypass capacitors placed as near as possible to the package.
In cases where separate power supplies are used for analog and digital power, the ground connection
between these supplies must be at the V_SSAD pin. This should be the only ground connection between these
supplies if possible. The V_SSAD pin makes a good single point ground location.
9.6.1.2 Analog Reference Pins
In addition to the analog supplies, the ADC module has connections for two reference voltage inputs. The
high reference is V_REFH, which may be shared on the same pin as V_DDAD on some devices. The low
reference is V_REFL, which may be shared on the same pin as V_SSAD on some devices.
When available on a separate pin, V_REFH may be connected to the same potential as V_DDAD, or may be
driven by an external source that is between the minimum V_DDAD spec and the V_DDAD potential (V_REFH
must never exceed V_DDAD). When available on a separate pin, V_REFL must be connected to the same
voltage potential as V_SSAD. Both V_REFH and V_REFL must be routed carefully for maximum noise
immunity and bypass capacitors placed as near as possible to the package.
AC current in the form of current spikes required to supply charge to the capacitor array at each successive
approximation step is drawn through the V_REFH and V_REFL loop. The best external component to meet this
current demand is a 0.1 µF capacitor with good high frequency characteristics. This capacitor is connected
between V_REFH and V_REFL and must be placed as near as possible to the package pins. Resistance in the
path is not recommended because the current will cause a voltage drop which could result in conversion
errors. Inductance in this path must be minimum (parasitic only).
9.6.1.3 Analog Input Pins
The external analog inputs are typically shared with digital I/O pins on MCU devices. The pin I/O control
is disabled by setting the appropriate control bit in one of the pin control registers. Conversions can be
performed on inputs without the associated pin control register bit set. It is recommended that the pin
control register bit always be set when using a pin as an analog input. This avoids problems with contention
because the output buffer will be in its high impedance state and the pullup is disabled. Also, the input
buffer draws DC current when its input is not at either V_DD or V_SS. Setting the pin control register bits for
all pins used as analog inputs should be done to achieve lowest operating current.
Empirical data shows that capacitors on the analog inputs improve performance in the presence of noise
or when the source impedance is high. Use of 0.01 µF capacitors with good high-frequency characteristics
is sufficient. These capacitors are not necessary in all cases, but when used they must be placed as near as
possible to the package pins and be referenced to V_SSA.
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 1.01
136
Freescale Semiconductor