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MC68HC08JB1 Datasheet, PDF (209/216 Pages) Motorola, Inc – Microcontrollers
3. Run (operating) IDD measured using external square wave clock source (fXCLK = 6 MHz). All inputs 0.2 V from rail. No dc
loads. Less than 100 pF on all outputs. CL = 20 pF on OSC2. All ports configured as inputs. OSC2 capacitance linearly
affects run IDD. Measured with all modules enabled.
4. Wait IDD measured using external square wave clock source (fXCLK = 6 MHz); all inputs 0.2 V from rail; no dc loads; less
than 100 pF on all outputs. CL = 20 pF on OSC2; 15 kΩ ± 5% termination resistors on D+ and D– pins; all ports configured
as inputs; OSC2 capacitance linearly affects wait IDD
5. STOP IDD measured with USB in suspend mode; OSC1 grounded; transceiver pullup resistor of 1.5 kΩ ± 5% between VREG
and D– and 15 kΩ ± 5% termination resistors on D+ and D– pins; no port pins sourcing current.
6. Maximum is highest voltage that POR is guaranteed.
7. If minimum VREG is not reached before the internal POR reset is released, RST must be driven low externally until minimum
VREG is reached.
16.7 Control Timing
Characteristic(1)
Internal operating frequency(2)
RST input pulse width low(3)
Symbol
Min
fOP
—
tIRL
125
Max
Unit
3
MHz
—
ns
NOTES:
1. VDD = 4.0 to 5.5 Vdc; VSS = 0 Vdc; timing shown with respect to 20% VDD and 70% VDD, unless otherwise noted.
2. Some modules may require a minimum frequency greater than dc for proper operation; see appropriate table for this infor-
mation.
3. Minimum pulse width reset is guaranteed to be recognized. It is possible for a smaller pulse width to cause a reset.
16.8 Oscillator Characteristics
Characteristic
Crystal frequency(1)
External clock
Reference frequency(1), (2)
Crystal load capacitance(3)
Crystal fixed capacitance(3)
Crystal tuning capacitance(3)
Feedback bias resistor
Series resistor(3), (4)
Symbol
Min
fXCLK
1
fXCLK
dc
CL
—
C1
—
C2
—
RB
—
RS
—
NOTES:
1. The USB module is designed to function at fXCLK = 6 MHz.
2. No more than 10% duty cycle deviation from 50%
3. Consult crystal vendor data sheet
4. Not required for high-frequency crystals
Typ
—
—
—
2 × CL
2 × CL
10 MΩ
—
Max
6
6
—
—
—
—
—
Unit
MHz
MHz
MC68HC08JB1 — Rev. 2.1
Freescale Semiconductor
Technical Data
209