PIC18FXX39 Datasheet, PDF (304/322 Pages) Microchip Technology – Enhanced FLASH Microcontrollers with Single Phase Induction Motor Control Kernel

PIC18FXX39
44-Lead Quad Flat No Lead Package (ML) 8x8 mm Body (QFN)
Land Pattern and Solder Mask
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
M
B
M
p
SOLDER
MASK
PACKAGE
EDGE
Pitch
Pad Width
Pad Length
Pad to Solder Mask
*Controlling Parameter
Units
Dimension Limits
p
B
L
M
Drawing No. C04-2103
MIN
__
__
.005
INCHES
NOM
.026 BSC
__
__
MAX
__
__
.006
MILLIMETERS*
MIN
NOM
0.65 BSC
__
__
__
__
0.13
MAX
__
__
0.15
DS30485B-page 304
Preliminary
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