PIC18FXX39 Datasheet, PDF (263/322 Pages) Microchip Technology – Enhanced FLASH Microcontrollers with Single Phase Induction Motor Control Kernel

PIC18FXX39
23.1 DC Characteristics: PIC18FXX39 (Industrial, Extended)
PIC18LFXX39 (Industrial) (Continued)
PIC18LFXX39
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  TA  +85°C for industrial
PIC18FXX39
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  TA  +85°C for industrial
-40°C  TA  +125°C for extended
Param
No.
Symbol
Characteristic
Min Typ Max Units
Conditions
Module Differential Current
D022 IWDT
Watchdog Timer —
PIC18LFXX39 —
—
0.75 1.5
28
10 25
A VDD = 2.0V, +25C
A VDD = 2.0V, -40C to +85C
A VDD = 4.2V, -40C to +85C
D022
D022A IBOR
D022A
D022B ILVD
D022B
Watchdog Timer —
PIC18FXX39 —
—
Brown-out Reset⁽⁴⁾ —
PIC18LFXX39 —
—
Brown-out Reset⁽⁴⁾ —
PIC18FXX39 —
—
Low Voltage Detect⁽⁴⁾ —
PIC18LFXX39 —
—
Low Voltage Detect⁽⁴⁾ —
PIC18FXX39 —
—
7 15 A VDD = 4.2V, +25C
10 25 A VDD = 4.2V, -40C to +85C
25 40 A VDD = 4.2V, -40C to +125C
29 35 A VDD = 2.0V, +25C
29 45 A VDD = 2.0V, -40C to +85C
33 50 A VDD = 4.2V, -40C to +85C
36 40 A VDD = 4.2V, +25C
36 50 A VDD = 4.2V, -40C to +85C
36 65 A VDD = 4.2V, -40C to +125C
29 35 A VDD = 2.0V, +25C
29 45 A VDD = 2.0V, -40C to +85C
33 50 A VDD = 4.2V, -40C to +85C
33 40 A VDD = 4.2V, +25C
33 50 A VDD = 4.2V, -40C to +85C
33 65 A VDD = 4.2V, -40C to +125C
Legend: Shading of rows is to assist in readability of the table.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode, or during a device RESET, without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an
impact on the current consumption.
The test conditions for all IDD measurements in active Operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS, and all
features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
4: The LVD and BOR modules share a large portion of circuitry. The IBOR and ILVD currents are not additive.
Once one of these modules is enabled, the other may also be enabled without further penalty.
 2002-2013 Microchip Technology Inc.
Preliminary
DS30485B-page 263