PIC18FXX39 Datasheet, PDF (303/322 Pages) Microchip Technology – Enhanced FLASH Microcontrollers with Single Phase Induction Motor Control Kernel

PIC18FXX39
44-Lead Plastic Quad Flat No Lead Package (ML) 8x8 mm Body (QFN)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
EXPOSED
METAL
PAD
D
D2
OPTIONAL PIN 1
INDEX ON
TOP MARKING
TOP VIEW
2
1
n
PIN 1
INDEX ON
EXPOSED PAD
p
B
E2
L
BOTTOM VIEW
A
A1
A3
Number of Pins
Pitch
Overall Height
Standoff
Base Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Lead Width
Lead Length
Units
Dimension Limits
n
p
A
A1
A3
E
E2
D
D2
B
L
MIN
.031
.000
.262
.262
.012
.014
INCHES
NOM
44
.026 BSC
.035
.001
.010 REF
.315 BSC
.268
.315 BSC
.268
.013
.016
MAX
.039
.002
.274
.274
.013
.018
MILLIMETERS*
MIN
NOM
44
0.65 BSC
0.80
0.90
0
0.02
0.25 REF
8.00 BSC
6.65
6.80
8.00 BSC
6.65
6.80
0.30
0.33
0.35
0.40
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC equivalent: M0-220
Drawing No. C04-103
MAX
1.00
0.05
6.95
6.95
0.35
0.45
 2002-2013 Microchip Technology Inc.
Preliminary
DS30485B-page 303