PIC24FJ16MC101_12 Datasheet, PDF (256/350 Pages) Microchip Technology – 16-bit Microcontrollers (up to 32 KB Flash and 2 KB SRAM)

PIC24FJ16MC101/102 AND PIC24FJ32MC101/102/104
26.1 DC Characteristics
TABLE 26-1: OPERATING MIPS VS. VOLTAGE
Characteristic
VDD Range
(in Volts)
Temp Range
(in °C)
Max MIPS
PIC24FJ16MC101/102 and
PIC24FJ32MC101/102/104
DC5
VBOR-3.6V⁽¹⁾
-40°C to +85°C
16
VBOR-3.6V⁽¹⁾
-40°C to +125°C
16
Note 1: Overall functional device operation at VBOR < VDD < VDDMIN is guaranteed but not characterized. All
device analog modules such as the ADC, etc., will function but with degraded performance below VDDMIN.
TABLE 26-2: THERMAL OPERATING CONDITIONS
Rating
Industrial Temperature Devices
Operating Junction Temperature Range
Operating Ambient Temperature Range
Extended Temperature Devices
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation:
Internal chip power dissipation:
PINT = VDD x (IDD – Σ IOH)
I/O Pin Power Dissipation:
I/O = Σ ({VDD – VOH} x IOH) + Σ (VOL x IOL)
Maximum Allowed Power Dissipation
Symbol Min
Typ
Max Unit
TJ
-40
—
+125
°C
TA
-40
—
+85
°C
TJ
-40
—
+140
°C
TA
-40
—
+125
°C
PD
PINT + PI/O
W
PDMAX
(TJ – TA)/θJA
W
TABLE 26-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol Typ Max Unit Notes
Package Thermal Resistance, 28-pin SPDIP
θJA
50
—
°C/W
1
Package Thermal Resistance, 20-pin SOIC
θJA
63
—
°C/W
1
Package Thermal Resistance, 28-pin SOIC
θJA
55
—
°C/W
1
Package Thermal Resistance, 20-pin SSOP
θJA
90
—
°C/W
1
Package Thermal Resistance, 28-pin SSOP
θJA
71
—
°C/W
1
Package Thermal Resistance, 28-pin QFN (6x6 mm)
θJA
37
—
°C/W
1
Package Thermal Resistance, 36-pin VTLA (5x5 mm)
θJA
31.1
—
°C/W
1
Package Thermal Resistance, 44-pin TQFP
θJA
45
—
°C/W
1,2
Package Thermal Resistance, 44-pin QFN
θJA
32
—
°C/W
1,2
Package Thermal Resistance, 44-pin VTLA
θJA
30
—
°C/W
1,2
Note 1: Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.
2: This package is available in PIC24FJ32MC101/102/104 devices only.
DS39997C-page 256
Preliminary
© 2011-2012 Microchip Technology Inc.