MRF24XA_15 Datasheet, PDF (246/258 Pages) Microchip Technology – Low-Power, 2.4 GHz ISM-Band IEEE 802.15.4™ RF

MRF24XA
32-Lead Very Thin Plastic Quad Flat, No Lead Package (MQ) - 5x5x0.9 mm Body [VQFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
ALTERNATE EXPOSED PAD
CONFIGURATION
Notes:
Units
Dimension Limits
Number of Pins
N
Pitch
e
Overall Height
A
Standoff
A1
Terminal Thickness
A3
Overall Width
E
Exposed Pad Width
E2
Overall Length
D
Exposed Pad Length
D2
Terminal Width
b
Terminal Length
L
Terminal-to-Exposed-Pad
K
MILLIMETERS
MIN
NOM
MAX
32
0.50 BSC
0.80
0.90
1.00
0.00
0.02
0.05
0.20 REF
5.00 BSC
3.70
-
3.90
5.00 BSC
3.70
-
3.90
0.18
0.25
0.30
0.30
0.40
0.50
0.20
-
-
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-160A Sheet 2 of 2
DS70005023C-page 246
Preliminary
 2015 Microchip Technology Inc.