MC68HC05P18 Datasheet, PDF (133/144 Pages) Freescale Semiconductor, Inc – Advance Information

Freescale Semiconductor, Inc.
Advance Information — MC68HC05P18/MC68HC805P18
Section 14. Mechanical Specifications
14.1 Contents
14.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .133
14.3 28-Pin Dual In-Line Package (Case #710) . . . . . . . . . . . . . . .134
14.4 28-Pin Small Outline Package (Case #751F) . . . . . . . . . . . . .134
14.2 Introduction
This section provides package dimension drawings for the 28-pin dual
in-line (DIP) or 28-pin small outline (SOIC) packages.
To make sure that you have the latest case outline specifications,
contact one of the following:
• Local Motorola Sales Office
• Motorola Mfax
– Phone [phone]
– EMAIL [e-mail]
• Worldwide Web (wwweb) at http://design-net.com
Follow Mfax or wwweb on-line instructions to retrieve the current
mechanical specifications.
MC68HC(8)05P18 — Rev. 2.0
MOTOROLA
Mechanical Specifications
For More Information On This Product,
Go to: www.freescale.com
Advance Information
133