CC2510FX Datasheet, PDF (248/253 Pages) List of Unclassifed Manufacturers – True System-on-Chip with Low Power RF Transceiver and 8051 MCU

CC2510Fx / CC2511Fx
20.1 Recommended PCB layout for package (QLP 36)
Figure 59: Recommended PCB layout for QLP 36 package
Note: The figure is an illustration only and not to scale. There are nine 14 mil diameter via holes
distributed symmetrically in the ground pad under the package. See also the CC2510Fx EM
reference design.
20.2 Package thermal properties
Thermal resistance
Air velocity [m/s] 0
Rth,j-a [K/W]
32
Table 71: Thermal properties of QLP 36 package
20.3 Soldering information
The recommendations for lead-free reflow in IPC/JEDEC J-STD-020C should be followed.
20.4 Tray specification
Tray Specification
Package Tray Length
QLP 36 322.6 mm
Tray Width
135.9 mm
Tray Height
7.62 mm
Table 72: Tray specification
Units per Tray
490
CC2510Fx/CC2511Fx PRELIMINARY Data Sheet (Rev. 1.2) SWRS055A Page 248 of 252