DS90UH940-Q1 Datasheet, PDF (85/87 Pages) Texas Instruments – FPD-Link III to CSI-2 Deserializer

NKD0064A
EXAMPLE BOARD LAYOUT
WQFN - 0.8 mm max height
WQFN
64X (0.6)
64
64X (0.25)
1
( 7.2)
SYMM
49
SEE DETAILS
48
60X (0.5)
SYMM
( 0.2) VIA
TYP
16
17
(8.8)
(1.36)
TYP
8X (1.31)
33
32
(1.36) TYP
(8.8)
LAND PATTERN EXAMPLE
SCALE:8X
8X (1.31)
0.07 MAX
ALL AROUND
METAL
0.07 MIN
ALL AROUND
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214996/A 08/2013
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, refer to QFN/SON PCB application note
in literature No. SLUA271 (www.ti.com/lit/slua271).
www.ti.com